Bipolar Switching Properties of GdOx:SiO2 Thin Film Resistive Random Access Memory Using Co-Sputtering Technology
نویسندگان
چکیده
Using two kinds of targets (gallium and silicon dioxide) the rf magnetron sputtering deposited technique, GdOx:SiO2 thin film RRAM devices were on TiN/Si substrate to form a metal–insulator–metal (MIM) structure. In addition, different oxygen concentrations power parameters prepared for films. Decrease defects vacancies films used repaired by rapid thermal annealing technology. Indium tin oxide (ITO) as top electrode was physical vapor deposition (PVD) method, ITO/GdOx:SiO2/TiN/Si structures films’ also made. current–voltage curves devices’ endurance properties measured an impedance analyzer. Finally, crystalline style, preferred phase, grain size, surface microstructure analyzed observed from X-ray diffraction field emission scanning electron microscope measurements.
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ژورنال
عنوان ژورنال: Crystals
سال: 2023
ISSN: ['2073-4352']
DOI: https://doi.org/10.3390/cryst13020156